Echelon FT 3150 Smart Transceiver Manuel d'utilisateur Page 6

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Table of Contents
iv FT 3120 / 3150 Smart Tranceiver Data Book
Appendix C - Design and Handling Guidelines .............................................129
Application Considerations ...........................................................................130
Termination of Unused Pins ...................................................................130
Avoidance of Damaging Conditions .......................................................130
Power Supply, Ground, and Noise Considerations .................................132
Decoupling Capacitors ............................................................................133
Board Soldering Considerations ...................................................................134
Soldering Through-hole Parts (FT-X1) ..................................................134
Soldering Surface Mount (SMT) Parts (Free Topology Transceivers) ..135
Handling Precautions and Electrostatic Discharge .......................................135
Electrostatic Discharge ...........................................................................138
Recommended Reading ..........................................................................139
Power Distribution and Decoupling Capacitors ...........................................139
Recommended Bypass Capacitor Placement ................................................140
Appendix D - Reference Design Schematics and Layout ...............................141
Mini Evaluation Kit Board ............................................................................142
FT 3150 Evaluatin Board Core......................................................................143
FT 3150 Evaluation Board Peripheral Circuitry............................................144
FT 3150 Evaluation Board Composite Top Layer.........................................145
FT 3150 Evaluation Board Top Layer...........................................................146
FT 3150 Evaluation Board Internal Ground Layer........................................147
FT 3150 Evaluation Board Internal Power Layer..........................................148
FT 3150 Evaluation Board Bottom Layer .....................................................149
FT 3150 Evaluation Board Composite Bottom Layer ...................................150
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